Everett Charles Technologies (ECT) probes with LFRE plating consistently outperform traditional Gold plated probes. In high volume production test applications a three to five percent improvement of first pass yield is typically recognized. Production output is significantly increased by longer probe life and mean time between maintenance (MTBM).
Lead free solder, and OSP treated copper pads typically present a harder or more abrasive contact surface causing excessive plating and probe tip wear. Lead free solder can cause multiple problems during circuit testing. Lead free solder typically has a thick layer of flux resin and oxide. This makes reliable electrical contact to the test points a challenge and increases probe tip wear.
ECT LFRE plated probes provide customers with a proven high volume production test solution for lead free PCBA test applications. They ensure reliable contact and longer life for probes in in-circuit test fixtures. In addition to improved tip ware, LFRE plated probes are less prone to solder transfer.
ECT’s LFRE plating has a hardness range of 550 to 650 Knoop, which is about three to four times harder than standard gold. This makes the probe tips more durable and less susceptible to solder and material transfer.
Besides the leading expertise in materials and platings, probes for lead free applications leverage ECT’s probe design and fabrication knowledge. The LFRE plated probes incorporate ECT’s proven PogoPlus® bias ball design and double roll close process. Both of which contribute to making sustainable reliable contact to PCB targets.
Lead free plating is featured on ECT’s industry standard PogoPlus® LFRE series, Metrix™, and on Long Travel probes.:
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